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US 4,394,532 AGranted
Multilayer current distribution systems and methods of fabrication thereof
AssigneeRogers Corporation
InventorArturo J. Aguayo
Life of this patent
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Abstract
A miniaturized bus bar is presented wherein a plurality of distribution prongs or fingers are mechanically and electrically bonded to a ribbon type capacitor which is defined by a pair of bus conductors and a ceramic spacer.
Claims5
A multilayer bus bar assembly including:
- capacitor ribbon means, said ribbon means comprising a continuous elongated dielectric member of rectangular cross sections and electrically conductive coatings on a pair of oppositely disposed planar surfaces of the dielectric member;
- and
- a plurality of distribution prong means on each of said planar surfaces, said prong means being comprised of an electrically conductive material, said prong means being mechanically and electrically bonded to respective coatings of said ribbon means.
A method of forming a bus bar assembly including the following steps:
- forming an elongated flat dielectric ceramic wafer having a rectangular cross-section;
- applying a layer of conductive material to a pair of opposed surfaces of the flat ceramic wafer;
- and
- electrically and mechanically bonding a plurality of transversely extending conductive distribution prongs to each of the conductive layers on the said opposed surfaces of the flat dielectric ceramic wafer.
1 more element
Dependencies are inferred from the claim text.