Plating resist with improved resistance to extraneous plating
AssigneeMinnesota Mining and Manufacturing Company
InventorRobert R. Rohloff
Life of this patent
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Abstract
Deposition of extraneous metal on the surface of an electroless or electrolytic plating resist is reduced by dispersing into the resist formulation fumed aluminum oxide microparticles.
Claims23
A photohardenable resist composition comprising polymerizable organic binder, a photoinitiator capable of initiating polymerization of said binder upon exposure to actinic radiation, and an effective amount, greater than 1% by weight, of aluminum oxide microparticles dispersed throughout said binder, said aluminum oxide microparticles being made by the flame hydrolysis of anhydrous aluminum halide.
A photohardenable resist composition comprising epoxide, triarylsulfonium hexafluoroantimonate, and about 10 to 20% by weight of fumed aluminum oxide microparticles made by the flame hydrolysis of anhydrous aluminum chloride.
A dry film negative photoresist composition comprising (1) carrier film and (2) a photosensitive layer carried on said film that is adherable to a printed circuit board substrate, reacts when exposed to an imagewise pattern of light to provide imagewise differential removability from said substrate, and comprises (a) photopolymerizable organic binder, (b) a catalytic amount of photoinitiator for initiating imagewise reaction of said binder upon imagewise exposure of said photosensitive layer to light, and (c) an effective amount, greater than 1% by weight, of aluminum oxide microparticles dispersed throughout said binder, said aluminum oxide microparticles being made by the flame hydrolysis of anhydrous aluminum halide.
A dry film positive photoresist composition comprising (1) carrier film and (2) a photosensitive layer carried on said film that is adherable to a printed circuit board substrate, reacts when exposed to an imagewise pattern of light to provide imagewise differential removability from said substrate, and comprises (a) photosolubilizable organic binder, (b) a catalytic amount of photoinitiator for initiating imagewise reaction of said binder upon imagewise exposure of said photosensitive layer to light, and (c) an effective amount, greater than 1% by weight, of aluminum oxide microparticles dispersed throughout said binder, said aluminum oxide microparticles being made by the flame hydrolysis of anhydrous aluminum halide.
A hardenable resist composition comprising an organic binder and from about 4 to 14% weight of the total weight of said composition of aluminum oxide microparticles dispersed throughout said binder, said aluminum oxide microparticles being made by the flame hydrolysis of anhydrous aluminum halide.
A printed circuit board having a plating resist pattern comprising a hardenable resist composition comprising an organic binder and an effective amount, greater than 1% by weight, of aluminum oxide microparticles dispersed throughout said binder, said aluminum oxide microparticles being made by the flame hydrolysis of anhydrous aluminum halide.
Dependencies are inferred from the claim text.