Sputtering apparatus
AssigneeHitachi, Ltd.
InventorsYoshio Homma, Sukeyoshi Tsunekawa, Hiroshi Morisaki, Seiki Harada
Life of this patent
Estimating the term…
Abstract
Herein disclosed is a sputtering apparatus in which a substrate electrode has its electrode surface plate made of a soft magnetic material. The thickness distribution of the film deposited is made uniform by the use of the sputtering apparatus.
Claims11
A sputtering apparatus comprising at least one cathode and at least one substrate electrode facing the cathode and having an electrode surface plate, the improvement wherein the electrode surface plate of said at least one substrate electrode facing said cathode has at least a portion thereof that is made of a soft magnetic material having an initial permeability of at least 100.
Dependencies are inferred from the claim text.