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US 4,393,581 AGranted
Method of forming leads on a lead frame
AssigneeAMP Incorporated
InventorGabriel B. Cherian
Life of this patent
Estimating the term…
Abstract
The present invention relates to a chip carrier wherein the leads therefrom are formed into a closely spaced pattern. More particularly, the invention discloses the method of stamping and forming the leads to achieve a high density arrangement.
Claims3
A method of forming a lead frame comprising the steps of:
- a. stamping out a flat lead frame having a center pad and a plurality of leads extending outwardly from one or more sides thereof, every other lead consisting of an inner end adjacent the center pad, a long outer end and a midsection intermediate the inner and outer ends and the leads in between the every other lead consisting of an inner end adjacent the center pad, a short outer end and a midsection intermediate the inner and outer ends, further said outer ends of all leads being stamped out to extend obliquely away from the midsection,
- b. forming one row of legs along a first side of the center pad by perpendicularly bending the short outer ends where the midsections and outer ends join;
- and
- c. forming a second row of legs spaced from and parallel to the first row of legs by perpendicularly bending the long outer ends at a predetermined distance outwardly from where the midsection and outer ends join.
1 more element
Dependencies are inferred from the claim text.