US 4,393,393 AGranted

Laser diode with double sided heat sink

AssigneeMcDonnell Douglas Corporation

InventorsLouis B. Allen, Jr., Herbert G. Koenig, Jr., Robert A. Stacy, Danny D. Meyer

Life of this patent

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Abstract

A laser diode is soldered between metal plates for intimate thermal and electrical contact. The plates are prefabricated and are provided with an insulative spacer therebetween. The two metal plates are held together in a preferred orientation by the spacer which is firmly adhered and sealed to the two plates during the diode soldering operation. The metal plates are constructed from material thin enough that they yield under thermal pressure of the diode to eliminate mechanical strain on the diode during thermal cycling. Backup plates are provided in contact with the diode mounting plates to feed electrical energy thereto.

Claims9

Dependent claims

A heat sink mounted laser diode including:

first and second flat mounting plates of a predetermined outer shape, each mounting plate having a solder pad of predetermined shape thereon, at least one of said mounting plates being relatively thin;
a laser diode soldered between said first and second mounting plates to said solder pads;
and
a least one flexible, electrically insulating spacer having heat activated adhesive properties positioned between said mounting plates, a predetermined outer shape similar to said predetermined outer shape of said mounting plates and a cutout adjacent said solder pads so said solder pads are not appreciably covered by said spacer, said adhesive retaining said spacer to said mounting plates, the thickness of said diode plus said solder connecting solder pads, and the thickness of said adhesive spacer being equal whereby there is relatively little mechanical strain applied to said diode.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 06/261,832Filed 8 May 1981 · continuation
Priority: 13 Aug 1979
Granted: 12 Jul 1983
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H01S 5/02423
Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling: liquid cooling, e.g. a liquid cools a mount…
H01S 5/0237
Fixing laser chips on mounts: by soldering
H01S 5/4018
Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30: lasers electrically in series
H01S 5/4025
Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30: array arrangements, e.g. constituted by discrete…

Family

Serial65,918Parent of this continuation · filed 13 Aug 1979
US 4,393,393 AThis patent

From the US filing history. Foreign family members aren’t listed.

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