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US 4,393,111 AGranted
Fabrication of conductor-clad composites using molding compounds and techniques
AssigneeBell Telephone Laboratories, Incorporated
InventorTheodore H. Klein
Life of this patent
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Abstract
Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.
Claims4
A molded composite, upon which a circuit of conductive material is defined, formed from a composition comprising:
- resin, 60-80 parts by weight;
- cross-linking monomer which forms a three dimensional network with the polymeric portion of the resin formulation, 0.5-60 parts by weight;
- low profile additive, 15-40 parts by weight;
- catalyst, 0.5-3 parts by weight;
- filler, 100-200 parts by weight;
- viscosity control agent, 0-5 parts by weight;
- and reinforcement, 20-250 parts by weight.
4 more elements
A molded composite, upon which a circuit of conductive material is defined, formed from a composition comprising:
- resin, about 9.709-34.03 percent by weight;
- cross-linking monomer which forms a three dimensional network with the polymeric portion of the resin formulation, about 0.08644-23.48 percent by weight;
- low profile additive, about 2.4470-18.90 percent by weight;
- catalyst, about 0.07868-1.511 percent by weight;
- filler, about 18.59-67.56 percent by weight;
- viscosity control agent, about 0-2.487 percent by weight;
- and reinforcement, about 4.902-58.68 percent by weight.
4 more elements
Dependencies are inferred from the claim text.