Magnetron cathode sputtering system
AssigneeU.S. Philips Corporation
InventorsJacobus E. Crombeen, Petrus W. H. M. Crooymans, Jan Visser
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Abstract
In a magnetron cathode sputtering system the target (plate of material to be sputtered) 8 is held against a backing plate 13 by a vacuum, enabling the backing plate 13 to be reused. By providing the backing plate with a layer of soldering material which adheres to the backing plate 13, but does not adhere to the target 8, heat transfer between the two plates is improved.
Claims4
A magnetron cathode sputtering system comprising, in an envelope, an anode and a flat cathode comprising a target in contact with a backing plate behind which means are provided to form a magnetic field near the target in the envelope, characterized in that the edge of the target is held against the edge of an aperture in the envelope in a gas-tight manner, said backing plate comprising a number of channels which communicate with the contact face of the target, the backing plate being held against the target by means of a vacuum in said channels.
Dependencies are inferred from the claim text.