Method and device for producing multilayer printed circuit boards

A method of assembling a plurality of printed circuit boards into a permanently bonded multilayer circuit board stock, the method comprising the steps of

• stacking printed circuit boards in alternation with bonding layers of thermosetting resin-based plastic to form multilayer stacks;
• heating a first multilayer stack under compression in a first panel press to a curing temperature at which the material of the bonding layers undergoes a curing process;
• precooling the first multilayer stack under compression in the first panel press to a transfer temperature which lies between the curing temperature and the ambient temperature;
• transferring the precooled first multilayer stack from the first panel press to a second panel press;
• loading a second multilayer stack in the first panel press;
• and
• aftercooling the transferred multilayer stack under compression in the second panel press to a temperature in the vicinity of the ambient temperature, while heating the second multilayer stack in the first panel press as aforesaid.