Device for inserting and removing circuit modules with multiple leads

A device for selectively inserting the leads of multi-leaded circuit modules into and withdrawing them from lead-engaging sockets secured to an associated substrate, said device comprising:

• a gripping jaw assembly including a support member, and a mutually disposed pair of longitudinally extending gripping jaws pivotally mounted on said support member and biased in a direction toward each other, a lower terminating end portion of each jaw being formed into a longitudinally disposed comb-like array of jaw segments, the jaw segments being shaped to grip different peripheral regions of a circuit module when positioned between said jaws, and to respectively extend between different adjacent pairs of an array of circuit leads when extending downwardly from a marginal side of a gripped circuit module;
• a stationary support assembly including a cross member and a mutually disposed pair of socket-abutting stop members respectively secured to opposite sides of said cross member, each of said stop members having a lower terminating end portion formed into a longitudinally disposed comb-like array of downwardly extending fingers, said fingers in each array being dimensioned and spaced to interleave with said associated array of gripping jaw segments,
• each of said stop member fingers being formed with an axially disposed groove of predetermined dimensions to substantially confine and facilitate the guiding of a circuit module lead into a receiving socket receptacle,
• and an actuable wheel-puller mechanism rotatably mounted on said cross member of said stationary support assembly, and having a downwardly extending rod portion coupled to said gripping jaw assembly, said rod portion having means thereon which are effective to cause, when rotated in a predetermined direction, the displacement of said gripping jaws, and a circuit module when gripped therebetween, relative to said stop members in a desired direction to allow the selective insertion and extraction of the leads of such a gripped circuit module into and out of respectively aligned receptacles of a related substrate-supported socket.