Process for making multi-layer cream-filled wafer blocks

A process for making multi-layer, filled wafer blocks having layers of wafer sheets, each wafer sheet having an upper and lower side, the process comprising the steps of:

• (a) applying a coating to the upper side of a first wafer sheet to form a first coated wafer sheet;
• (b) conveying, with a feeder conveyor, the first coated wafer sheet in a first plane to a stacking point at which stacking point the first wafer sheet is to be raised into a second plane which is above the first plane;
• (c) separately supplying, simultaneously with said conveying step, an uncoated covering wafer sheet for each wafer block, said supplying being carried out such that the covering wafer sheet is delivered directly into said second plane at the stacking point without being transported along the feeder conveyor;
• (d) thereafter raising the first coated wafer sheet into the second plane and, by such raising, attaching the first coated wafer sheet to the lower side of the uncoated covering wafer sheet already in the second plane to form a stack of two wafer sheets, which stack is in a raised position with respect to the feeder conveyor, said attaching being effected by the contact of the coating of the first coated wafer sheet with the lower side of the uncoated covering sheet in the second plane;
• (e) forming a completed stack of wafer sheets constituting a completed wafer block by, if one or more additional layers are desired, applying a coating to an additional wafer sheet to form an additional coated wafer sheet;
• conveying, with the feeder conveyor, the additional wafer sheet in the first plane to the stacking point;
• thereafter raising the additional coated wafer sheet into the second plane and by such raising;
• attaching the additional coated wafer sheet to the lower side of a wafer sheet at the bottom of the stack of wafer sheets in the second plane, and repeating said steps of applying a coating to an an additional wafer sheet, conveying the additional coated wafer sheet, raising the additional coated wafer sheet, and attaching the additional coated wafer sheet, n minus 3 times, where n is the number of sheets in the final stack;
• and
• (f) thereafter removing the completed wafer block from the stacking point.