Transfer lamination of copper thin sheets and films, method and product
AssigneeGeneral Electric Company
InventorsEric Lifshin, Joseph D. Cargioli, Stephen J. Schroder, Joe Wong
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Abstract
A copper-clad laminate having special utility in the production of high resolution printed circuit patterns by either subtractive or semi-additive processing is made by vapor depositing a film of zinc on a copper film on a silica-coated aluminum carrier sheet, vapor depositing a silica film on the resulting zinc-copper foil, bonding the resulting body to a substrate and then stripping the silica-coated aluminum carrier sheet from the copper-clad laminate.
Claims6
A metal-clad laminate comprising a substrate, a layer of copper and bonding means located between said substrate and said copper layer for bonding said substrate and copper layer together, said bonding means consisting of an ultra-thin film of zinc on said copper layer together with an ultra-thin film of oxide selected from the group consisting of aluminum oxide and silicon dioxide disposed between and in contact with said zinc film and said substrate.
A laminate product comprising a thin copper sheet, an ultra-thin film of zinc vapor deposited on said copper sheet and a film of silica vapor deposited on said zinc film.
Dependencies are inferred from the claim text.