Method for shielding electronic equipment by coating with copper containing composition
AssigneeAcheson Industries, Inc.
InventorsSteven R. Stoetzer, Robert E. Wiley
Life of this patent
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Abstract
A new copper dispersion coating composition particularly useful as a copper shielding coating for plastic enclosures to protect electronic equipment from electromagnetic interference (EMI). The coating maintains high electrical conductivity even after exposure to heat, humidity or salt spray. The coating composition may also be used as a one-coat air dry system that is spray applied and needs no protective overcoat.
Claims9
A method for shielding an electronic device having an enclosure associated therewith, said method being comprised of protecting said device from electromagnetic interference (EMI) by applying to said enclosure a coating composition comprised of,
- a pigment material substantially of copper said pigment being finely particulated and having a particle size of less than about 200 microns,
- a binder resin, the pigment to binder weight ratio in said composition being between about 20 to 1 and about 2 to 1,
- an organic titanate material of the pyrophosphate type for providing good heat stability to the coating as applied to the enclosure,
- said organic titanate being present in amount of about 1/2% to about 18% by weight of said pigment material,
- and, an organic solvent carrier for the composition, said composition containing a weight percent total solids within a range of about 20% to about 85%.
Dependencies are inferred from the claim text.