Semiconductor component with several semiconductor elements
AssigneeSiemens Aktiengesellschaft
InventorWalter Bahlinger
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Abstract
Semiconductor component with a plurality of semiconductor elements disposed in a case having a metallic bottom being in heat-conducting contact with the semiconductor elements, electrical leads, and a leaf spring having ends and providing electrical pressure contact between the semiconductor elements and the leads, including yokes each holding a respective end of the spring, and at least two screws anchoring the yokes and the semiconductor elements to the bottom.
Claims5
Semiconductor component with a plurality of semiconductor elements disposed in a case having a metallic bottom being in heatconducting contact with the semiconductor elements, electrical leads, and a leaf spring having ends and providing electrical pressure contact between the semiconductor elements and the leads, comprising yokes each holding a respective end of the spring, and at least two screws anchoring said yokes and the semiconductor elements to the bottom.
Dependencies are inferred from the claim text.