Positive novolak photoresist compositions
AssigneePhilip A. Hunt Chemical Corporation
InventorsMedhat A. Toukhy, Leo Klawansky
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Abstract
Fast positive photoresist compositions employing cresol-formaldehyde novolak resins made from a mixture containing meta- and paracresol or ortho-, meta- and paracresol in a ratio selected from a given range and one or more of a selected group of naphthoquinone diazide sensitizing compounds. When dissolved in a mixture of organic solvents, the photoresist compositions are suitable for application as a thin coating to a substrate. After the coating has been dried, the coated substrate can be exposed to image-wise modulated actinic radiation even in the deep ultra-violet range and developed in alkaline solution, yielding a high-resolution relief pattern of resist on substrate useful for a number of applications.
Claims10
A positive photoresist composition, comprising a mixture of:
- (a) about 80 to 99 percent by weight of a cresolformaldehyde novolak resin produced by condensing a mixture of cresol isomers with formaldehyde in the presence of acid, said mixture of cresols including percentages by weight of ortho-, meta-, and paracresols whose values are within the area bounded by quadrilateral ABCD in FIG. 1, said novolak resin having a softening point in the range of 110.degree. to 145.degree. C.;
- and
- (b) about 1 to 20 percent by weight of at least one napthoquinone diazide sensitizer selected from the group consisting of:
- ##STR5## wherein ##STR6##
Dependencies are inferred from the claim text.