Shielded plating cell and method

Abstract

Disclosed is a shielded plating cell which will permit continuous transfer of a printed circuit board by a single conveyor, whether chain-type, endless belt, or other unit is employed. The plating head and sparger assembly include a reverse flow chamber in which an anode is positioned thereby reversing the flow of the pressure fluid and creating a venturi effect in an area beneath a pair of shields which flexibly engage the printed circuit board and shield the upper portion as well as environment from the escape of spray. To assist in this shielding, an adjustable choke is provided so that the operator can manually balance the unit by shifting the choke to eliminate any pumping action which occurs in the delta formed at the ends of the printed circuit boards where the shields do not abruptly come together. Additionally, squeegee gates are provided at both ends of the cell to inhibit the migration of plating fluid outside the cell into related processing areas. The method is directed to the provision of those elements which permit balancing the choke to a point where pumping does not occur above the shields. In instances where fine adjustment can be made, the taping of the printed circuit board can be eliminated and the flexible shields serve the masking function as well.

Dependencies are inferred from the claim text.