Curable epoxy resin compositions

Abstract

The invention provides a novel curable epoxy resin composition suitable for resin encapsulation of various electronic devices such as transistors, ICs, LSIs and the like with high anti-moisture resistance and without causing excessive stress upon curing to the electronic devices. The resin composition comprises an epoxy resin, a curing agent such as a phenol novolac resin, a filler and a curing catalyst such as an imidazole compound as well as an organosilicon polymer represented by the general formula ##STR1## in which R is a monovalent hydrocarbon group such as methyl, Z is a divalent organic group such as ethylene and phenylene, n is a positive number of at least 10 on an average and a and b are each zero or a positive number not exceeding 1 with the proviso that a+b is in the range from 1 to 2 inclusive, in a limited amount.

Dependencies are inferred from the claim text.