Plasma etching of aluminum
AssigneeRCA Corporation
InventorBernard Halon
Life of this patent
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Abstract
A method of improving uniformity of etching in the plasma etching of a substrate of aluminum and its alloys by supporting the substrate on a getter plate of a metal such as tantalum. The getter plate extends beyond the substrate for a distance sufficient to improve the uniformity of etching across the substrate.
Claims9
In a process of plasma etching a substrate of aluminum or an alloy thereof with an etchant gas containing boron trichloride, the improvement comprising supporting the substrate on a metal getter plate which extends outwardly from the edges of the substrate for a distance sufficient to cause substantially uniform etching across the substrate having improved uniformity.
Dependencies are inferred from the claim text.