Process for the immersion deposition of gold
AssigneeOccidental Chemical Corporation
InventorsMohamed F. El-Shazly, Kenneth D. Baker, Yvonne Rymwid
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Abstract
An electroless plating process for depositing gold on substrates, such as metal and metallized substrates, which involves immersing the substrates in an electroless plating bath composed of a trivalent gold complex, an organic carboxylic acid, and/or a mineral acid sufficient in amount so that the pH of the bath will range from about 0.1 to 6.0. The process of utilizing said electroless bath to deposit gold on the aforementioned substrates is also disclosed and claimed.
Claims8
A process for electroless plating gold on a substrate which comprises immersing such substrate in an electroless gold plating bath which comprises a trivalent gold complex selected from alkali metal auricyanides and alkali metal auric imides in an amount which is at least sufficient to deposit gold on the substrate up to the maximum solubility of the complex in the bath, and at least one of the following ingredients:
- (a) an organic carboxylic acid, and
- (b) a mineral acid in amounts sufficient to adjust the pH of the bath to from about 0.1 to 6.0 and maintaining such substrate immersed in said bath, without the passage of electrical current therethrough, for a period of time sufficient to form an immersion deposit of gold on said substrate.
Dependencies are inferred from the claim text.