Resin composition comprising water-soluble polyamide and vinyl alcohol-based polymer
AssigneeUnitika Ltd.
InventorsTakashi Okamoto, Osamu Doi
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Abstract
A resin composition is described consisting essentially of from 0.5 to 100 parts by weight of a water-soluble polyamide and from 0.5 to 100 parts by weight of a vinyl alcohol-based polymer. The resin composition has excellent transparency and can be used, for example, to form light-sensitive resin compositions and adhesives.
Claims21
A resin composition consisting essentially of a water-soluble polyamide and a vinyl alcohol-based polymer in a ratio of from about 0.5/100 to 100/0.5, wherein the water-soluble polyamide contains a sulfonic acid group, a salt of a sulfonic acid group or an ammonium salt type of nitrogen atom and further wherein the linking groups of the water-soluble polyamide are substantially essentially amido bonds.
A resin composition comprising, per 100 parts by weight of a water-soluble polyamide, from about 0.5 to 100 parts by weight of a vinyl alcohol-based polymer, wherein the water-soluble polyamide contains a sulfonic acid group, a salt of a sulfonic acid group or an ammonium salt type of nitrogen atom and further wherein the linking groups of the water-soluble polyamide are substantially essentially amido bonds.
A resin composition comprising, per 100 parts by weight of a vinyl alcohol-based polymer, from about 0.5 to less than 100 parts by weight of a water-soluble polyamide, wherein the water-soluble polyamide contains a sulfonic acid group, a salt of a sulfonic acid group or an ammonium salt type of nitrogen atom and further wherein the linking groups of the water-soluble polyamide are substantially essentially amido bonds.
A light-sensitive resin plate including a resin composition consisting essentially of a water-soluble polyamide and a vinyl alcohol-based polymer in a ratio by weight of from about 0.5/100 to 100/05, wherein the water-soluble polyamide contains a sulfonic acid group, a salt of a sulfonic acid group or an ammonium salt type of nitrogen atom and further wherein the linking groups of the water-soluble polyamide are substantially essentially amido bonds.
An adhesive material including a resin composition consisting essentially of a water-soluble polyamide and a vinyl alcohol-based polymer in a ratio by weight of from about 0.5/100 to 100/0.5, wherein the water-soluble polyamide contains a sulfonic acid group, a salt of a sulfonic acid group or an ammonium salt type of nitrogen atom and further wherein the linking groups of the water-soluble polyamide are substantially essentially amido bonds.
A water-soluble hot-melt type of adhesive material wherein the resin composition comprises, per 100 parts by weight of a vinyl alcohol-based polymer, from about 0.5 to less than 100 parts by weight of a water-soluble polyamide, wherein the water-soluble polyamide contains a sulfonic acid group, a salt of a sulfonic acid group or an ammonium salt type of nitrogen atom and further wherein the linking groups of the water-soluble polyamide are substantially essentially amido bonds.
Dependencies are inferred from the claim text.