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US 4,364,977 AGranted
Automatic self-adjusting processing apparatus
AssigneeNational Semiconductor Corporation
InventorCarl E. Bernardi
Life of this patent
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Abstract
An automatic self-adjusting processing apparatus for plating an object is described. The apparatus has a plating head, an apparatus coupled to the plating head which is responsive to the presence of the object for indicating the relative position of the plating head and the object, and an apparatus coupled to the indicating apparatus for automatically adjusting, if necessary, the relative position of the plating head and the object to a predetermined relative position.
Claims6
A self-adjusting object processing apparatus comprising:
- a plating head;
- indicating means for indicating the relative position of said processing apparatus and said object, said indicating means including means to convey a stream of fluid to a hole in said object, the relative position of the hole in the object and said indicating means having an effect on the pressure of said fluid;
- pressure indicating means for indicating the magnitude of the fluid pressure;
- and
- adjusting means responsive to said pressure indicating means for automatically adjusting the position of said plating head relative to said object as a function of the magnitude of said pressure.
2 more elements
A method of plating an object comprising the steps of:
- transporting the object to a plating head;
- directing a stream of fluid against at least one aperture in said object;
- measuring the back pressure in said stream;
- providing an output that is a function of said back pressure;
- and
- if necessary, adjusting the position of the plating head to obtain a predetermined output.
3 more elements
Dependencies are inferred from the claim text.