Socket for a bubble memory package
AssigneeAMP Incorporated
InventorsBilly E. Olsson, Lit Y. Kam
Life of this patent
Estimating the term…
Abstract
A socket for a bubble memory package includes a pair of housings containing rows of electrical terminals for contact with circuit pads of the package. The housings are aligned by integrally joined tie bars which are removable after assembly of the housings on a circuit board. Metal spring clamps provide large clamping forces to assure electrical contact between the terminals and circuit pads, and to restrain the high mass package during vibration.
Claims8
A socket for an electronic package in which the socket is adapted for mounting on a circuit board and electrical connections are established between terminals of the socket and circuit pads on said package, the socket comprising:
- first and second housings containing respective rows of said terminals, said housings being of different height and having inclined top wall surfaces supporting a circuit element of said package at a desired incline on a circuit board,
- said terminals having resilient spring portions projecting outwardly beyond said top wall surfaces and engageable with circuit pads on each said circuit element and being resiliently deflected by each said circuit element seated against said top wall surfaces, and
- a resilient spring element overlying the reverse side of each said circuit element and clamping each said circuit element against said deflected spring portions and against respective said top wall surfaces.
Dependencies are inferred from the claim text.