Process for the production of corrugated paperboard adhesive
AssigneeMPW Tech. Associates
InventorsFranklyn O. Ware, William S. McDonald
Life of this patent
Estimating the term…
Abstract
Improved Stein-Hall type adhesives having an uncooked slurry portion and a cooked carrier portion wherein the carrier portion is produced by cooking a slurry of a starch having substantial amylopectin content, at an alkaline pH, in the presence of an amount of hydrogen peroxide sufficient to lower the viscosity of the cooked carrier to that of conventional Stein-Hall carriers, viz., so that when added to the secondary slurry, the viscosity of the finished adhesive will be about 40 to 50 seconds (Stein-Hall) at 100.degree.-105.degree. F., and in the presence of a catalyst effective to reduce the cooking time required to reach that viscosity to about 15 minutes or less.
Claims10
A method for the production in the starch kitchen of a corrugating plant of a Stein-Hall composite adhesive whose carrier portion has the high solids content conventionally achieved only with a high amylose starch, employing a starch having a substantial amylopectin content, which comprises (a) employing in the cooked portion a starch having a substantial amylopectin content;
- (b) employing an amount of the starch in the slurry used to produce the cooked portion in excess of that which would produce a viscosity low enough, if the slurry were cooked conventionally, to be acceptable for use in a Stein-Hall composite adhesive;
- and (c) cooking the slurry at an alkaline pH, in the presence of an amount of hydrogen peroxide, in a weight ratio to the starch of from about 300:1 to 600:1, which is sufficient to lower the viscosity of the cooked carrier to that of conventional Stein-Hall carriers and in the presence of an amount of a catalyst, in a weight ratio of H.sub.2 O.sub.2 to catalyst of about 15:1 to 40:1, which is effective to reduce the cooking time required to reach that viscosity to about 15 minutes or less.
Dependencies are inferred from the claim text.