Ultra-violet lithographic resist composition and process
AssigneeInternational Business Machines Corporation
InventorsRichard D. Balanson, Nicholas J. Clecak, Barbara D. Grant, Augustus C. Ouano
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Abstract
Phenolic-aldehyde resins sensitized with Meldrum's diazo or a homologue thereof are useful as lithographic resists sensitive to deep ultra-violet light.
Claims6
A lithographic resist composition for use with ultraviolet light of less than 3,000 A wavelength, said composition comprising a phenolic-aldehyde resin and in admixture therewith as a deep ultra-violet sensitizer, a sufficient quantity of compound having the formula ##STR3## wherein R.sub.1 is alkyl or aryl having up to 20 carbon atoms, R.sub.2 is H, alkyl or aryl having up to 20 carbon atoms, or together R.sub.1 and R.sub.2 are cycloalkyl whereby upon exposure to deep ultra-violet radiation, the composition becomes more soluble in alkaline developer.
A process for forming a lithographic resist image comprising image-wise exposing to ultra-violet light of less than 3000 A wavelength a film cast on a substrate and comprising a phenolic-aldehyde resin and in admixture therewith a sensitizer having the formula ##STR4## wherein R.sub.1 is alkyl or aryl having up to 20 carbon atoms, R.sub.2 is H, alkyl or aryl having up to 20 carbon atoms, or together R.sub.1 and R.sub.2 are cycloalkyl, and dissolving the exposed portion of said film with aqueous alkali.
Dependencies are inferred from the claim text.