Colloidal compositions for electroless deposition stabilized by thiourea
OwnerNathan Feldsteininventor
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Abstract
Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless (chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.
Claims18
A method for improving the stability of a colloidal dispersion comprising a non-precious metal and a solvent wherein said metal is catalytic for electroless metal initiation comprising the step of incorporating a compound selected from the group consisting of ##STR2## (NH.sub.2).sub.2 C.dbd.Se, and (NH.sub.2).sub.2 C.dbd.O and mixtures thereof and wherein R.sub.1 and R.sub.2 are selected from the group consisting of alkyl, amines, aromatics, hydrogen and halogen into said colloidal dispersion thereby improving the stability for said colloidal dispersion.
A process for the electroless metallization of a non-conductor substrate comprising the steps of:
- (1) contacting said substrate with a colloidal dispersion comprising a non-precious metal catalytic for electroless metal initiation and a compound selected from the group consisting of ##STR3## (NH.sub.2).sub.2 C.dbd.Se and (NH.sub.2).sub.2 C.dbd.O and mixture(s) thereof and wherein R.sub.1 and R.sub.2 are selected from the group consisting of alkyl, amines, aromatics, hydrogen, and halogen, and
- (2) contacting the treated substrate with a compatible electroless plating composition.
Dependencies are inferred from the claim text.