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AssigneesHitachi, Ltd., Hitachi Haramachi Semi-Conductor, Ltd.
InventorsKazutoyo Narita, Tadashi Sakaue, Noboru Kawasaki, Motoji Nakajima
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A semiconductor device comprises a heat-radiating electrode plate, a semiconductor element soldered to the depressed portion formed in the heat-radiating electrode plate, a header lead soldered onto the semiconductor element, a terminal board of insulating material fixed on the heat-radiating electrode plate, and a lead terminal secured to the terminal board and with the one end thereof electrically and mechanically connected to the header lead. The semiconductor device further comprises means for mitigating the transmission to the solder of the stress generated along the length of the header lead by the difference in the coefficient of thermal expansion among the component parts, and means for alleviating the lateral stress generated in the solder by the difference in the coefficient of thermal expansion between the header lead and the semiconductor element. Thus, a semiconductor device is provided which is high in both resistance to thermal fatigue and vibrations, simple in construction and superior in operational efficiency.
A semiconductor device comprising a heat-radiating plate including a depressed portion, a semiconductor element soldered to said heat-radiating plate in said depressed portion, a header lead including a lead section extending in a direction perpendicular to said heat-radiating plate and a header section located at one end of said lead section and soldered onto said semiconductor element, a terminal board fixed on said heat-radiating plate, wherein said lead section has a bent portion thinner than the rest of the lead section, a lead terminal supported by said terminal board and electrically and mechanically connected to the other end of said lead section, an elastic insulating material filled into said depressed portion covering and providing air-tight sealing for said semiconductor element and said header section, said bent portion of said lead section being exposed outside of said insulating material so that said bent portion can alleviate transmission of a stress generated along the length of said lead section to said solder without separating said insulating material from said heat-radiating plate.
A semiconductor assembly comprising a plurality of semiconductor devices each including:
Dependencies are inferred from the claim text.