Stud-mounted pressure assembled semiconductor device

Abstract

A semiconductor wafer having one or more junctions is mounted on the pedestal of a threaded stud. The stud has a hexagonal outer surface and an upstanding hollow cylindrical member which forms an enclosure for the semiconductor wafer. A rigid lead having an enlarged head is placed on top of the wafer and is pressed into contact with the wafer by washer springs that are held under tension by being connected to the outer upstanding cylindrical housing of the stud. Pressure is applied from the washers through an alumina washer which is seated atop a thin mica washer. The thin mica washer ensures insulation in the event that the alumina washer is fractured. Teflon centering rings are provided for centering the molybdenum expansion electrode, the wafer and the enlarged head of the upper electrical conductor in pressure contact with the semiconductor wafer. The centering rings have a suitable annular cutout to receive any outwardly bulging silastic which is used to passivate the junction of the wafer within the package. The molybdenum expansion electrode is loosely mounted and is nickel plated whereby a nickel plated surface makes sliding contact with the aluminum electrode of the semiconductor wafer. Easily machined parts are used throughout the assembly and the parts can be interchangeably used for a forward polarity device or reverse polarity device.

Dependencies are inferred from the claim text.