Method for selective removal of copper contaminants from activator solutions containing palladium and tin
AssigneeEnthone Inc.
InventorConstantine I. Courduvelis
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Abstract
A method is provided for selective removal of copper contaminants from aqueous activator solutions which also contain palladium and tin. It comprises placement of insoluble electrodes in the aqeuous solution and application of a low voltage, preferably ranging from between 0.05 to 5.0 volts across the electrodes, whereby metallic copper is selectively deposited upon the cathode, with palladium and tin remaining in the aqueous solutions. Typically, the soluble copper ions are present as contaminants in activator solutions utilized in various electroless metal plating processes.
Claims8
A method for selective removal of copper contaminants from aqueous activator solutions containing palladium and tin, comprising:
- (a) placing insoluble electrodes in said aqueous solution, and
- (b) applying a voltage ranging from between about 0.05 to 5.0 volts across said electrodes,
- whereby metallic copper is selectively deposited on the cathode, while substantially all of said palladium and said tin remain in said aqueous solution.
Dependencies are inferred from the claim text.