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US 4,301,231 AGranted
Negative resist for high energy radiation
AssigneeToray Industries, Inc.
InventorsYuji Atarashi, Mutsuo Kataoka
Life of this patent
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Abstract
Negative resist materials comprising soluble, film-forming polymers with side branches containing vinyl silyl groups are used for pattern generation on exposure to high energy radiation such as electron beams or X-rays.
Claims5
A resist material capable of forming a negative image by application of radiation, said material comprising an organic polymer with branches at least some of which contain vinyl silyl groups and are represented by the formula ##STR11## wherein R.sup.1 is a divalent organic bonding, R.sup.2 is a monovalent organic group other than vinyl group and n is an integer of 1 to 3.
Dependencies are inferred from the claim text.