Sputtering apparatus
AssigneeMurata Manufacturing Co., Ltd.
InventorsHiroshi Nishiyama, Takeshi Nakamura, Suehiro Kato, Kenji Ando
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Abstract
There is disclosed a combination of a target of a material other than metals and one of opposed electrodes of a sputtering apparatus for the deposition of thin films on substrates wherein the target is soldered on the electrodes by a low-melting alloy consisting essentially of a Pb-Sn-Zn alloy and at least one additive selected from the group consisting of Sb, Al, Ti, Si, Cd and Cu. This target installation enables to prevent porous or poor heat-conducting targets from the breakage resulting from the increase of the film-forming rate or physical properties of the target material such as ceramics, glasses, resins and the like.
Claims5
A sputtering apparatus for the deposition of non-metallic thin-films on substrates, comprising:
- a pair of opposed electrodes;
- a substrate layer mounted on one of said electrodes;
- a target layer of a non-metallic material mounted on the other of said pair of electrodes, said target layer comprising Zn0;
- a low temperature melting alloy layer interposed between said target layer and the other of said pair of electrodes for soldering said target layer to said other of said pair of electrodes, said low temperature melting alloy layer including Pb, Sn, and Zn, and further including at least one additive selected from the group consisting of Sb, Al, Ti, Si, Cd and Cu.
Dependencies are inferred from the claim text.