Sputtering apparatus
AssigneeUltra Electronic Controls Limited
InventorRoger G. Duckworth
Life of this patent
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Abstract
The invention describes an electrode assembly for use in a sputtering apparatus. In the sputtering assembly, a cathode mount is insulatingly supported on an anode and carries a target rod. The target rod has a much smaller surface area than the surrounding surface of the anode. High power is supplied to the cathode so that the temperature of the target rod should reach approximately 1000.degree. C. This results in a high rate of sputtering and in the deposition of a pure coating.
Claims7
A sputtering apparatus, comprising a cathode mount adapted to support a target rod and to be electrically connected to a source of high voltage, an anode supporting the cathode mount and electrically insulated therefrom, means for supporting an object to be sputter-coated arranged outside the volume bound by the anode and the target rod, wherein the anode has a surface greater in area than the target rod so as to enable the flow of a current of sufficient density to raise the temperature of the target rod to substantially 1000.degree. C., said anode surface being rotationally symmetrical and centered on the target rod and so shaped as to direct the bombarding ions at an angle onto the surface of the target rod.
An apparatus as claimed in any preceding claim, wherein the surface of the anode is frusto-conical, parabolic or part-spherical.
Dependencies are inferred from the claim text.