Method and apparatus for removing dice from a severed wafer
AssigneeWestern Electric Company, Inc.
InventorsRobert W. Garrett, Sr., Donald E. Horning, Dennis L. Merkel
Life of this patent
Estimating the term…
Abstract
Removing dice (16) from a wafer (10) which has been attached to a tape layer (12, 14) and severed into individual die (16) leaving the tape layer (12, 14) in one piece is accomplished by attaching the tape layer (12, 14) to a length of adhesive tape (18). The adhesive tape (18) is passed across a surface (20) and through a slot (38) in the surface (20) causing the die (16) to pass across the slot (38) and away from the tape layer (12, 14) which remains attached to the adhesive tape (18).
Claims7
Apparatus for separating dice from a severed wafer comprising:
- a first surface with an edge located thereon;
- flexible adhesive material attached to the wafer and adapted to pass across said first surface and over said edge of said first surface for releasing a forward advancing edge of a plurality of dice in the wafer from said flexible adhesive material and for pulling away said flexible adhesive material from the remaining portion of said plurality of dice;
- a second surface located in a spaced relationship with said edge of said first surface forming a slot therebetween and providing a support for said forward advanced edge of said plurality of dice and a receiving area for said plurality of dice after removal from said flexible adhesive material;
- a dice receiving area;
- and
- a dice transport tool for attaching to the backside of the dice and for transporting the dice to said dice receiving area;
- said receiving area having in said second surface a recess of sufficient size and shape to permit insertion therein of the dice transport tool for attaching to the backside of the dice.
A method for separating dice from a sliced wafer attached to a flexible adhesive material comprising the steps of:
- passing the flexible adhesive material across a first surface and over an edge located on said first surface causing a bending of the flexible material and releasing a forward advancing edge of a plurality of dice in the wafer from the flexible adhesive material;
- supporting said forward advancing edge of said plurality of dice with a second surface located in a spaced relationship with said first surface forming a slot therebetween;
- further passing said flexible adhesive material over said edge of said first surface for pushing said plurality of dice forward onto said second surface and for pulling the flexible adhesive material away from the remaining portion of said plurality of dice;
- positioning a movable tool in a recess in said second surface adjacent to said slot;
- attaching said movable tool to the backside of each of the dice after they become free of the flexible adhesive material;
- and
- transporting each of the dice with said movable tool to a dice receiving area.
Dependencies are inferred from the claim text.