Bonding head
AssigneeWestern Electric Company, Inc.
InventorsGeorge A. Chayka, Fred J. Schneider
Life of this patent
Estimating the term…
Abstract
A thermode (12) of a thermocompression bonding head (11) is adjustably mounted to a frame (35). A bonding tip (26) of the thermode (12) rests against a reference surface (17). After an initial adjustment of the thermode (12) with respect to a bonding platform (37), the bonding tip (26) may be removed from the thermode (12) and replaced by another identical tip (26) without a need for readjusting the thermode (12) with respect to the bonding platform (37). A comparatively large interface surface area between a dovetailed groove (16) and the mating surfaces of the bonding tip (26) and a wedging action of the dovetailed section urging mating surfaces against each other minimize thermal resistance across the interface between the thermode (12) and the bonding tip (26).
Claims3
A thermocompression bonding head for bonding electrical component parts, which comprises:
- a thermode including a body having at least one cavity for mounting a heating element, a dovetailed groove extending in the body adjacent to said cavity, said dovetailed groove being formed by two opposite, inwardly diverging sidewalls intersecting a flat reference surface, said reference surface being parted by a slot extending into said body to a depth sufficient for resiliently hinging the portion of said body on one side of said slot with respect to the portion of said body on the other side of said slot;
- and
- a bonding element having a base reference surface, inwardly sloping sidewalls adjoining said base reference surface at two parallel edges thereof and a bonding end having at least one bonding rail extending parallel to said parallel edges, said bonding element being insertable into said groove upon a resilient expansion of said sidewalls of said groove with respect to each other, such that, upon said bonding element being inserted within said groove, said base reference surface is adjacent to said reference surface of said groove, said bonding end protrudes from said groove, the sidewalls of the groove resiliently bear on the sidewalls of the bonding element, and the reference surface on the thermode and the base reference surface of the bonding element are located in mutual, intimate, heat conducting contact.
Dependencies are inferred from the claim text.