Spin coating process
AssigneeFuji Photo Film Co., Ltd.
InventorShinichi Sakawaki
Life of this patent
Estimating the term…
Abstract
A process for spin coating a substrate such as a semi-conductor wafer uniformly with a coating solution such as a photographic emulsion by rotating the substrate at a first speed while simultaneously applying the coating solution at a radially moving position. Once the substrate has been initially covered, the speed of rotation of the substrate is increased and rotation continues until a uniform coating is obtained.
Claims16
A spin coating method in which after a coating solution is supplied onto a horizontal substrate, said substrate is rotated about a rotary axis perpendicular to said substrate, and a coated film is formed to a desired thickness on said substrate by controlling the speed of rotation of said substrate, the improvement comprising;
- while said substrate is being rotated at a low speed of 50 to 150 rpm., moving a coating solution supplying nozzle radially of said rotating substrate to supply said coating solution onto said substrate to substantially uniformly coat said substrate with said coating solution and thereafter, said substrate is subsequently rotated to produce a desired thickness of said coating solution upon said substrate.
A spin coating method comprising the steps of:
- rotating a substrate about an axis perpendicular to said substrate at a first speed;
- supplying a coating solution to a surface of said substrate from a starting position and moving radially with respect to said axis;
- and
- rotating said substrate at a second speed greater than said first speed after portions of said substrate have been covered with said coating solution.
Dependencies are inferred from the claim text.