Charge transfer, tetrode bucket-brigade device
AssigneeReticon Corporation
InventorHsin-fu Tseng
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Abstract
An improved BBD structure is disclosed which is realized with MOS, two layer, polysilicon technology. In the tetrode structure, the transfer gate overlaps the tetrode gate with no intermediate substrate region. The storage capacitor is off-set from the propagation channel and is formed by the two layers of polysilicon without using a p-n junction. High transfer efficiency is obtained over a wide frequency range with a shorter length per stage.
Claims8
An MOS bucket-brigade, charge transfer, device fabricated on a semiconductor substrate comprising a channel of propagation, and a plurality of stages each of which includes:
- a first gate having first and second opposite sides;
- a second gate having first and second opposite sides, said first side of said second gate overlapping said second side of said first gate;
- a doped region in said substrate spaced-apart from said second side of said first gate and extending between said second side of said second gate and said first side of said first gate of the next succeeding one of said stages;
- and
- said first gate being formed from a layer of conductive material;
- a capacitor disposed between said region and said second gate, said capacitor comprising an extension of said second gate disposed apart from the channel of propagation in said device and an underlying member formed from said layer of conductive material, said underlying member being in contact with said regions;
- whereby high charge transfer efficiency in said bucket-brigade device is realized.
A bucket-brigade, charge transfer, device disposed on a silicon substrate having a path of propagation, and a plurality of stages each of which comprises:
- a first gate insulated from said substrate, said first gate having a first and second side crossing the path of propagation in said device;
- a second gate having a first and second side which cross said path of propagation, said first side of said second gate overlapping said second side of said first gate, said second side of said second gate crossing said path of propagation beyond said second side of said first gate, said second gate being insulated from said first gate and said substrate;
- a doped region in said substrate extending along said path of propagation from said second side of said second gate to said first side of said first gate of the next one of said stages;
- and,
- a capacitor disposed between said region and said second gate, said capacitor comprising a portion of said second gate which extends beyond said path of propagation and a polysilicon member, insulated from said portion of said second gate, said member being in contact with said region;
- whereby a highly efficient charge transfer device is realized.
Dependencies are inferred from the claim text.