Wafer orienting apparatus
AssigneeInternational Business Machines Corporation
InventorsHugo A. E. Santini, David P. Wick
Life of this patent
Estimating the term…
Loading patent…
AssigneeInternational Business Machines Corporation
InventorsHugo A. E. Santini, David P. Wick
Estimating the term…
An apparatus and method for orienting a substantially flat wafer are described. The wafer preferably has two flat registration edges of unequal length. Upon contact of any edge portion of the wafer with a sensor projecting forwardly from one registration surface, air jets are activated to rapidly rotate the wafer one way until the longer of its two registration edges contacts a sensor projecting forwardly from another registration surface. Then air jets are activated to slowly rotate the wafer the opposite way until said longer registration edge contacts another sensor associated with said other registration surface to effect precise registration of the wafer without overshoot as all three sensor are concurrently contacted and activated. Wafer movement by the jets thereupon terminates and vacuum is applied continuously to hold the wafer in place while the work operation is performed thereon. Since the wafer is registered solely by contact with the various sensor (and not by contact with the respective registration surfaces), contamination of the wafer by physical contact is minimized.
Apparatus for orienting a substantially flat wafer or the like having a flat registration edge, said apparatus comprising:
A method for orienting a wafer or the like in a precise position defined by registration of a substantially flat edge portion of the wafer with one of two registration surfaces associated with a support table, comprising the steps of:
Dependencies are inferred from the claim text.