Multi-level large scale complex integrated circuit having functional interconnected circuit routed to master patterns
AssigneeHughes Aircraft Company
InventorsDonald F. Calhoun, Barry Bennett
Life of this patent
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AssigneeHughes Aircraft Company
InventorsDonald F. Calhoun, Barry Bennett
Estimating the term…
A complex integrated circuit comprising a wafer which has a plurality of cells each having signal-connect pads in a first layer of metalization on the wafer and which has an imperfect yield of usable cells. The circuit further includes a laminae of alternate layers of dielectric insulation and metalization formed on the wafer wherein: a first layer of insulation has vias formed therethrough to expose signal-connect pads of selected usable cells; a second layer of metalization has conductors formed therein which operably interconnect the exposed signal-connect pads of one or more groups of usable cells into individual functional circuits and, where needed, include pad relocation conductors which route the signal-connects of individual cells and the signal-connects of interconnected groups of cells to master pattern circuit locations; a second layer of insulation has vias formed therethrough which expose signal-connect portions at the master pattern circuit locations; and a third layer of metalization is formed into conductors that interconnect the signal-connects at master pattern locations into a functionally specified circuit type.
A multi-level complex integrated circuit of the type which defines a configuration of signal-connect portions, vias and integrated circuits which are the same in location for a plurality of wafers having the same functional circuit type, including:
A complex integrated circuit structure in a single body which defines a configuration at least of circuit locations and electrical routings that are the same in location for all other circuit structures capable of performing a particular electrical function, the structure comprising:
A plurality of integrated circuit members each capable of performing the same electrical function, and each comprising:
In a unitary integrated circuit member capable of performing an electrical function and having a plurality of functionally separate circuits located thereon, in which some of said functionally separate circuits are usable and the remainder are unusable and in which said usable and unusable circuits have random positions differing from similar functionally separate usable and unusable circuits on other unitary integrated circuit members capable of performing the same electrical function, and in which each of said circuits have means for defining a plurality of individual signal-connects at a first level of metalization, the improvement in providing at least a partially integrated interconnection of said usable circuits having a standard pattern of identical locations of means for defining second individual signal-connects, said usable circuits being selected from any of said usable circuits irrespective of their positions on any of said circuit members, and said standard pattern being the same for all of said circuit members, comprising:
A plurality of integrated circuit members each capable of performing the same electrical function and each comprising:
Dependencies are inferred from the claim text.