Dual-pull air cooling for a computer frame

#This invention relates to an air cooling arrangement for computer frames and, more particularly, to an air cooling arrangement having individual dual path air flow and control thereof for each module to maintain a predetermined temperature thereof.

#One object of the present invention is to provide an air cooling arrangement having high volume air flow in which each module is located in two individual air paths, thereby increasing the cooling capabilities.

#Another object of the present invention is to provide an air cooling arrangement in which two blowers are provided to pull air individually into each module and then exhaust it so each module can be maintained at the same temperature.

#In the accompanying drawings forming a material part of this disclosure:

#FIG. 1 is a schematic view of the prior art push-pull cooling arrangement for electronic modules in a computer frame;

#FIG. 2 is a schematic partially cross-sectional view of an electronic module having fins attached thereto as the heat sink;

#For further comprehension of the invention, and of the objects and advantages thereof, reference will be had to the following description and accompanying drawings, and to the appended claims in which the various novel features of the invention are more particularly set forth.

#A prior art electronic module 10, housing integrated circuit chips 12, is shown in FIG. 2. The heat transfer path is from the chips to the adjacent conduction stud 14, across the gap between the cylinder 16 walls and the stud, and through the housing 18 to the heat sink fins 20 attached thereto. The fins 20 provide a large surface area for the dissipation of the heat. The heat transfer from the fins 20 to air is enhanced by blowing the air over the finned surface. The volume of air moved through the fins 20 is limited by the size of the blower, and also the noise created at higher velocities.

#An example of use of such a module 10 is shown in FIG. 1, which is a schematic diagram of a matrix of modules 10, each having an attached finned heat sink 20, and in which the air cooling arrangement is provided by a blower 22 at the top which pulls the air through the fins 20 of the modules 10, and a blower 24 at the bottom which pushes the air through the fins 20 of the modules 10. The air flow is across the module 10, parallel to the fins 20, as indicated by the arrows in FIG. 1. It should be appreciated that the temperature of the cooling air is lower at the bottom row of modules 10 than at the top row of modules, since the air at the top row of modules contains the heat obtained from the modules below in the same column. Thus, the modules 10 at the top row are at a higher temperature than the modules below.