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US 4,233,620 AGranted
Sealing of integrated circuit modules
AssigneeInternational Business Machines Corporation
InventorsRussell E. Darrow, Irving Memis, Richard M. Poliak
Life of this patent
Estimating the term…
Abstract
The hermetic seal of the backside of a substrate of an integrated circuit module is provided by a composition containing about 51.4 to about 60.6% by weight of an epoxy polymer; about 39 to about 48% by weight of a hardener and flexibilizing portion; and up to about 0.6% by weight of a coloring agent.
Claims22
An integrated circuit module containing a substrate having electrically-conductive pins protruding therefrom, and having attached to the backside thereof at least one integrated circuit chip wherein the improvement comprises providing a hermetical seal of the backside of the substrate contained within a cap with a composition over the substrate and a portion of the height of the pins containing:
- (A) about 51.4 to about 60.6% by weight of an epoxy of at least about 95% of which being a diglycidyl ether of bisphenol A and epichlorohydrin, having an epoxy equivalent weight of about 180 to about 210 and a viscosity of about 6,500 to about 22,500 centipoise at 25.degree. C.;
- (B) about 39 to about 48% by weight of a hardener and flexibilizer portion containing
- (1) about 15 to about 49% by weight of an anhydride hardener for said epoxy wherein said anhydride is selected from the group of nadic methyl anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride or mixtures thereof;
- (2) about 40 to about 85% by weight of a polyglycol flexibilizer represented by the formula:
- HO--R--O--[--R--O--].sub.n R--OH
- wherein R is a divalent saturated aliphatic hydrocarbon moiety selected from the group of ethylene, propylene, butylene, and mixtures thereof;
- and wherein n is 0 or an integer such that the molecular weight of said flexibilizer in conjunction with the amount employed is such that the viscosity of the hardener and flexibilizer portion is about 900 to about 2500 centipoise at 25.degree. C.;
- (3) 0.1 to about 1% by weight of a tertiary amine curing agent for the epoxy;
- and
- (4) 0 to minor amounts of acid resulting from hydrolysis of said anhydride;
- wherein said minor amount is such that the acid number of the hardener and flexibilizer portion does not exceed about 4.0 mg KOH/gram;
- and wherein the amounts of B(1), B(2) and B(3) and B(4) are based upon the total of B(1), B(2), B(3) and B(4) of the hardener and flexibilizer portion;
- and
- (C) 0 to about 0.6% by weight of a coloring agent.
11 more elements
A sealing composition consisting essentially of
- (A) about 51.4 to about 60.6% by weight of an epoxy at least about 95% of which being a diglycidyl ether of bisphenol A and epichlorohydrin, having an epoxy equivalent weight of about 180 to about 210 and a viscosity of about 6,500 to about 22,500 centipoise at 25.degree. C.;
- (B) about 39 to about 48% by weight of a hardener and flexibilizer portion containing
- (1) about 15 to about 49% by weight of an anhydride hardener for said epoxy wherein said anhydride is selected from the group of nadic anhydride, tetrahydrohexahydrophthalic anhydride, tetrahydrophthalic anhydride or mixtures thereof;
- (2) about 40 to about 85% by weight of a polyglycol flexibilizer represented by the formula:
- HO-R-O-[-R-O-].sub.n R-OH
- wherein R is a divalent saturated aliphatic hydrocarbon moiety selected from the group of ethylene, propylene, butylene, and mixtures thereof;
- and wherein n is 0 or an integer such that the molecular weight of said flexibilizer in conjunction with the amount employed is such that the viscosity of the hardener and flexibilizer portion is about 900 to about 2500 centipoise at 25.degree. C.;
- (3) 0.1 to about 1% by weight of a tertiary amine curing agent for the epoxy;
- and
- (4) 0 to minor amounts of acid resulting from hydrolysis of said anhydride;
- wherein said minor amount is such that the acid number of the hardener and flexibilizer portion does not exceed about 4.0 mg KOH/gram;
- and wherein the amounts of B(1), B(2), B(3) and B(4) are based upon the total of B(1), B(2), B(3) and B(4) of the hardener and flexibilizer portion;
- and
- (C) 0 to about 0.6% by weight of a coloring agent.
11 more elements
A process for hermetically sealing the backside of the substrate of an integrated circuit module which comprises:
- (A) providing a substrate having electrically-conductive pins protruding therefrom;
- and having attached to the backside thereof at least one integrated circuit chip;
- (B) placing said substrate into a cap wherein the backside of said substrate is covered by said cap;
- (C) providing a composition over the exposed surface of the substrate and a portion of the height of the pins wherein said composition contains
- (1) about 51.4 to about 60.6% by weight of an epoxy at least about 95% of which being a diglycidyl ether of bisphenol A and epichlorohydrin, having an epoxy equivalent weight of about 180 to about 210 and a viscosity of about 6,500 to about 22,500 centipoise at 25.degree. C.;
- (2) about 39 to about 48% by weight of a hardener and flexibilizer portion containing
- (a) about 15 to about 49% by weight of an anhydride hardener for said epoxy wherein said anhydride is selected from the group of nadic anhydride, tetrahydrohexahydrophthalic anhydride, tetrahydrophthalic anhydride, or mixtures thereof;
- (b) about 40 to about 85% by weight of a polyglycol flexibilizer represented by the formula:
- HO--R--O--[--R--O--].sub.n R--OH
- wherein R is a divalent saturated aliphatic hydrocarbon moiety selected from the group of ethylene, propylene, butylene, and mixtures thereof;
- and wherein n is 0 or an integer such that the molecular weight of said flexibilizer in conjunction with the amount employed is such that the viscosity of the hardener and flexibilizer portion is about 900 to about 2500 centipoise at 25.degree. C.;
- (c) 0.1 to about 1% by weight of a tertiary amine curing agent for the epoxy;
- and
- (d) 0 to minor amounts of acid resulting from hydrolysis of said anhydride;
- wherein said minor amount is such that the acid number of the hardener and flexibilizer portion does not exceed about 4.0 mg KOH/gram;
- and wherein the amounts of 2(a), 2(b), 2(c) and 2(d) are based upon the total of 2(a), 2(b), 2(c) and 2(d) of the hardener and flexibilizer portion;
- and
- (3) 0 to about 0.6% by weight of a coloring agent;
- and
- (D) curing said composition to hermetically seal the backside of said substrate within said cap.
17 more elements
Dependencies are inferred from the claim text.