Method of improving the adhesion of electroless metal deposits employing colloidal copper activator
AssigneeLeaRonal, Inc.
InventorWilliam Brasch
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Abstract
The present invention relates to a method for promoting and improving the adhesion of an electroless metal deposit to the metal surface of a composite substrate having both a conductive metal area and an activated non-conductive surface. The process comprises treating such a substrate, subsequent to catalyzation or activation of the substrate, and prior to electroless metal deposition thereon, with an adhesion promotor compound or mixture of compounds.
Claims5
A method for promoting and improving the adhesion of an electroless metal deposit to the metal portion and a non-conductive portion which comprises treating the composite substrate with a copper type colloidal system to cause activation of the non-conductive portion thereof for electroless metal deposition, and thereafter treating the activated substrate, including the metal portions thereof, with an adhesion promoter compound selected from hydrazine hydrate, ammonium persulfate, or alkali hydroxide prior to the step of electroless deposition.
Dependencies are inferred from the claim text.