Extended drain self-aligned silicon gate MOSFET
AssigneeRCA Corporation
InventorSheng T. Hsu
Life of this patent
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Abstract
A Metal-Oxide-Semiconductor-Field Effect Transistor (MOSFET) is described wherein a body of semiconductor material is provided with source, drain and channel regions. A gate structure is provided over the interstitial channel region of the semiconductor body between the drain and source regions, one edge of which is aligned with the source region. The remainder of the channel region, between the other edge of the gate structure and the adjacent edge of the drain region is provided with a drift region of a conductivity type that is opposite to that of the source and drain.
Claims3
In an improved extended drain field effect transistor of the type including a body of semiconductor material in which spaced drain and source regions of a first conductivity type, with a given concentration of conductivity modifiers, are embedded at the surface of the body, the drain and source regions spaced a given distance one from the other to define the channel region, a first layer of insulating material disposed over the channel region, and a gate member disposed on the first insulating layer over the channel region, the improvement comprising:
- the portion of the channel region adjacent the source region having a second conductivity type opposite the first conductivity type;
- the remainder of the channel region, adjacent the drain region, forming a drift region of the first conductivity type with a lower concentration of conductivity modifiers therein than the drain and source regions;
- and
- the gate member is disposed solely over the channel region with the edges thereof in alignment with respective edges of the source and drift regions.
Dependencies are inferred from the claim text.