Chemical vapor deposition reactor and process
AssigneeApplied Materials, Inc.
InventorsRichard S. Rosler, Robert W. East
Life of this patent
Estimating the term…
Abstract
Apparatus and process for depositing materials such as Si.sub.3 N.sub.4 and SiO.sub.2 on semiconductor wafers in a hot-wall reactor. A perforated distribution tube is positioned in the reaction chamber, and the wafers are placed inside the tube. Reactant gases are introduced into the chamber outside the tube and pass to the wafers through the openings in the tube.
Claims7
In a process for forming films of relatively uniform thickness on a plurality of generally planar wafers in a reaction chamber having an elongated distribution tube of slightly greater diameter than the wafers with a plurality of axially spaced openings formed therein, the steps of:
- A. placing the wafers in the distribution tube with the wafers spaced axially along the tube so that the major surfaces of the wafers are generally perpendicular to the axis of the tube and the spacing between adjacent ones of the wafers is at least as great as the distance between the edges of the wafers and the side wall of the distribution tube;
- B. introducing a reactant gas into the chamber outside the tube with the pressure within the chamber at a subatmospheric level;
- and
- C. permitting the gas to pass through the openings in the tube to the wafers for a time sufficient to deposit a layer of predetermined thickness on the wafers.
In apparatus for forming films of relatively uniform thickness on a plurality of generally planar wafers:
- A. a generally cylindrical reactor tube defining a reaction chamber;
- B. a distribution tube disposed within the reactor tube and spaced therefrom to form a plenum chamber between the side walls of the tubes, the distribution tube having a slightly greater diameter than the wafers and a plurality of axially spaced openings formed in its side wall to provide communication between the plenum chamber and the interior of the distribution tube;
- C. means for holding the wafers in an axially spaced relationship inside the distribution tube with the major surfaces of the wafers generally perpendicular to the axis and the spacing between adjacent ones of the wafers being at least as great as the distance between the edges of the wafers and the side wall of the distribution tube;
- D. a resistance heating coil positioned coaxially about the reactor tube;
- E. means for introducing a reactant gas into the plenum chamber toward one end thereof;
- and
- E. means for maintaining the pressure in the reaction chamber at a subatmospheric level as the gas is introduced.
In a chemical vapor deposition reactor for forming films of relatively uniform thickness on a plurality of generally planar substrate members:
- A. an axially elongated reaction chamber formed at least in part by an enclosing wall;
- B. heater means positioned outside the chamber for heating the chamber wall and the interior of the chamber;
- C. an axially extending distribution tube having a slightly greater diameter than the wafers and a plurality of axially spaced openings;
- D. means for holding the substrate members in an axially spaced relationship within the distribution tube with the major surfaces of the substrate members generally perpendicular to the axis of the chamber and the spacing between adjacent ones of the wafers at least as great as the distance between the edges of the wafers and the distribution tube;
- E. means for introducing a gaseous reactant into the chamber in the region between the chamber wall and the distribution tube for passage through the openings to the substrate members;
- and
- F. means for maintaining the pressure in the chamber at a subatmospheric level during introduction of the gaseous reactant.
Dependencies are inferred from the claim text.