Method for fabricating controlled TCR thin film resistors
AssigneeGeneral Dynamics Corporation, Electronics Division
InventorsRonald A. Thiel, Edward H. Maurer
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Abstract
High stability thin film resistors are made from an alloy comprising selected portions of nickel, chromium, and gold selected in a ratio to provide the desired temperature coefficient of resistance (TCR). The resistors are made by co-depositing gold with the nickel chromium alloy by a flash evaporation process. The evaporation process is carried out by feeding a nickel chromium wire, having a gold wire extending therealong to provide the desired composition, onto a heated tungsten strip within a vacuum system with substrates disposed in a position to obtain uniform deposition of the evaporated material thereon.
Claims13
A method of fabricating thin film resistors comprising the steps of:
- selecting a dielectric substrate, and
- co-deposit preselected percentages of gold, nickel and chromium on said substrate forming a resistive film of not more than 5,000 angstroms in thickness of an alloy consisting of gold, nickel and chromium wherein the percentage of gold is no greater than the combined percentage of nickel and chromium.
Dependencies are inferred from the claim text.