Thermal conduction module
AssigneeInternational Business Machines Corporation
InventorRichard C. Chu
Life of this patent
Estimating the term…
Abstract
A matrix of small diameter holes are located in the module housing adjacent each of the integrated circuit chips to be cooled. A pin or rod is located in each of the holes and extends therefrom into contact with the exposed surface of the chip. A spring means is located between the housing and the pin to provide a predetermined spring loading of the pin-piston against the exposed surface of the chip. A header is located at the outer end of the pin-piston in contact with the exposed surface of the chip thereby, providing multiple pin-piston contact with the exposed surface of the chip regardless of the chip tilt which improves the heat transfer. The heat transfer can be controlled by including or removing pin-pistons in accordance with the heat transfer desired.
Claims10
In a thermal conduction module for providing cooling of one or more integrated circuit chips having an exposed surface comprising:
- a housing having a surface adjacent the exposed surface of said circuit chips;
- a plurality of cylindrical openings adjacent each chip extending into said housing from the surface facing said circuit chips;
- a plurality of pin-pistons, one located in each of said plurality of cylindrical openings adjacent each chip and extending therefrom into contact with the exposed surface of said circuit chip;
- a spring means located between said housing and each of said pin-pistons to provide a predetermined spring loading force of said pin-piston against the exposed chip surface;
- and
- header means located at the outer end of each of said pin-pistons in contact with the exposed chip surface;
- said pin-pistons contacting the exposed chip surface even when the chip is tilted thereby providing improved heat transfer.
Dependencies are inferred from the claim text.