Apparatus for practicing temperature gradient zone melting

An apparatus for the simultaneous processing of one or more bodies of semiconductor material by temperature gradient zone melting, said apparatus comprising:

• a closable work chamber for receiving said semiconductor bodies for processing and including a first closure member and a second closure member;
• said first closure member having a radiative heating element heat source facing internally of said work chamber for heating said semiconductor bodies;
• said second closure member including a heat sink facing internally of said chamber and located opposite to said heat source, said heat sink cooperating with said heat source to produce a relatively uniform temperature gradient within said bodies of semiconductor material;
• said closure members defining at least in part said work chamber and at least one of said closure members being movable to allow access to the interior of said work chamber;
• means disposed in said work chamber for supporting said bodies of semiconductor material during processing;
• first means for storing bodies of semiconductor material prior to processing in said closable work chamber;
• second means for storing bodies of semiconductor material after processing in said closable work chamber;
• a first actuation means for providing relative movement between said first and said second closure members to effect the opening and closing of said work chamber;
• means for transferring one or more bodies of semiconductor material from said first storage means to said closable work chamber, for disposing said one or more bodies on said supporting means, and for transferring said one or more bodies from said supporting means to said second storage means;
• manipulative means for selectively engaging and supporting said bodies of semiconductor material during a transferring sequence, said manipulative means comprising
• (1) means for selectively attaching to said bodies of semiconductor material, and
• (2) a second actuation means for placing said attaining means in contact with said bodies of semiconductor material;
• drive means for moving said manipulative means toward and away from a plurality of stations including the interior of said closable work chamber, said first storage means, and said second storage means,
• said drive means comprising
• (1) means including a third actuation means for propelling said manipulative means in a rectilinear direction, and
• (2) means including a fourth actuation means for pivotally propelling said manipulative means in an arcuate direction.