Apparatus for practising temperature gradient zone melting

Apparatus for the processing of one or more bodies of semiconductor material by temperature gradient zone melting, said apparatus including:

• (a) a closable work chamber in which the temperature gradient zone melting process is practiced, said closable work chamber comprising a first closure member having a heat source therein and a second closure member having a heat sink therein;
• (b) means disposed in said work chamber for supporting said bodies of semiconductor material therein;
• (c) a first actuator means for providing relative movement between said first and said second closure members to effect the opening and the closing of said work chamber;
• (d) said heat source facing internally of said work chamber and comprising radiative heating elements for heating said bodies of semiconductor material;
• (e) the heat sink cooperating with said heat source to produce a relatively uniform temperature gradient within said bodies of semiconductor material during processing;
• (f) first means for storing a plurality of bodies of semiconductor bodies prior to the transfer of said bodies to said closable work chamber;
• (g) second means for storing a plurality of bodies of semiconductor bodies after the transfer of said bodies from said closable work chamber;
• (h) manipulative means for selectively engaging and supporting a plurality of bodies of semiconductor material in transit from said first storage means to said closable work chamber, and from said closable work chamber to said second storage means;
• (i) drive means for moving said manipulative means to and from said first storage means, said second storage means and said said closable work chamber, and
• (j) means for operating said manipulative means for engaging and releasing a plurality of bodies of semiconductor material,
• (k) said manipulative means comprising
• (1) means including at least one vacuum line adapted for communication with a vacuum source for selectively attaching to said bodies of semiconductor material, a single one of said bodies of semiconductor material being engageable and supportable by said vacuum line at one end thereof through suction, and
• (2) a second actuator for placing said attaching means in contact with said bodies of semiconductor material, said single one of said bodies of semiconductor material being supported at said end of said vacuum line by application of a vacuum to the said vacuum line, and said single one of said bodies of semiconductor material being released from said end of said vacuum line by removal of the vacuum from said vacuum line.