Amorphous monomolecular surface coatings
AssigneeBard Laboratories, Inc.
InventorAlbert P. Yundt
Life of this patent
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Abstract
The self-aligning characteristics of surface-active molecules are used to provide a multiply-coupled thin film surface coating on a substrate, comprising an outermost layer of normally fluid, flexible backbone chain polymer units of at least about 30 atoms in length, the ends of which are attached by chemical bonds to a relatively highly polar second layer of atoms serving to anchor the relatively fluid outer surface layer polymer chains to the surface of the substrate.
Claims22
In a method for providing a photoresist pattern on a semiconductor wafer substrate in which a mask surface is passed into intimate contact with the outer surface of a photoresist layer covering a semiconductor wafer substrate, the mask is exposed to actinic radiation for the selective irradiation of the photoresist layer covering the semiconductor substrate and the mask is removed from contact with the photoresist covered semiconductor substrate surface to provide a selectively soluble photoresist pattern on the wafer substrate, the improvement comprising providing for improved separation of the mask surface by coating at least one of said surfaces, with an abhesive, monomolecularly thin, substantially amorphous loop-bonded film, said loop-bonded abhesive film being formed of polymer chains each attached at the same one of said surfaces by bonding groups at the respective ends of said chains to form surface-bound, non-crystalline loops having a length of at least about 60 Angstroms.
A method for providing a substantially amorphous, non-crystalline, momomolecularly thin film coating on a suitable substrate, comprising the steps of
- providing a solution comprising flexible backbone polymer chain units having a length of at least about 60 Angstroms, said chain units having polar chemical bonding groups chemically bonded to the ends of said chain units said polar bonding groups being adapted for bonding attachment of said polymer chain ends to said substrate, and a solvent for said polymer chain units, and
- contacting said substrate with said solution to orient said polar bonding groups at the ends of said polymer chain units to the surface of said substrate in contact with said solution, and to bond the ends of said chains to said substrate to produce a randomly oriented, substantially momomolecularly thin loop structure of said chains in attachment at said surface.
A photomask for use in integrated circuit manufacture comprising a photoplate substrate having a mask pattern thereon, and a substantially amorphous, monomolecularly thin abhesive loop-bonded film on at least the surface of said mask substrate adapted to be placed in contact with a photoresist coated semiconductor wafer during integrated circuit manufacture, said loop-bonded film being formed of normally fluid, flexible polymer chains bonded at their chain ends to said surface to form surface bound noncrystalline loops of said chains projecting from said surface and having a length of at least about 60 A.
A coated substrate having modified surface properties comprising a substrate, and an amorphous, substantially monomolecularly thin, non-crystalline loop-bonded layer on said substrate, said amorphous, monomolecularly thin loop-bonded layer being formed of normally fluid flexible polymer chains each having a plurality of chain ends bonded to the substrate surface by means of bonding groups chemically bonded to said chain ends to provide surface-bonded polymer chain loops projecting from said surface and having a length of at least about 60 A.
A semiconductor substrate for use in integrated circuit manufacture comprising a semiconductor wafer, a photoresist coating on said wafer, and a substantially amorphous, monomolecularly thin film of loop-bonded polymer chains having a length of at least about 60 Angstroms on the surface of said photoresist coating to be placed in contact with a photomask for selective irradiation of said photoresist coating during integrated circuit manufacture said loop bonded chains forming non-crystalline loops projecting from said surface having a length of from about 60 to about 800 A.
A coated substrate having surface properties substantially modified by an amorphous, monomolecularly thin surface coating comprising a supporting substrate and a surface coating on said substrate in the form of a substantially monomolecularly thin amorphous loop-bonded film comprising a first outermost layer of normally fluid flexible backbone chain polymer units averaging at least thirty atoms in length and arranged in the form of loops with their respective ends chemically bonded to relatively polar groupings of five or more atoms at each free end of each of said chain polymer units and forming a second layer of said surface coating immediately adjacent the surface of said supporting substrate and intermediate said substrate and said first outermost layer.
Dependencies are inferred from the claim text.