Method of making semi-conductor mounts
AssigneeGKN Floform Limited
InventorJohn S. Waite
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Abstract
A method of making a mount for a solid state semi-conductor comprising a mounting part secured to a body element comprising the steps of positioning a mounting part in contact with a body element, applying heat to the body element in the region of the inter-face between the body element and the mounting part by conduction from the mounting part for a time and at a temperature to cause melting of the body element in the region of the inter-face and consequently to cause bonding of the mounting part to the body element.
Claims13
A method of making a mount for a solid state semi-conductor comprising a mounting part secured to a body element comprising the steps of positioning a mounting part in contact with a body element, in a jig, the jig engaging the mounting part and having good thermal conductivity, subjecting the jig to a temperature above the melting point of the body element for a time to cause application of heat to the body element in the region of the interface between the body element and the mounting part by conduction of heat from the jig through the mounting part to the body element to raise the temperature of the region of the interface above its melting point to cause localized melting of the body element only in said region of the interface to cause fusion bonding of the mounting part of the body element and thereafter cooling the jig at a rate such that the remainder of the body element remains below its melting point.
Dependencies are inferred from the claim text.