Dual inline integrated circuit socket

An improved socket for receiving the leads of a dual inline integrated circuit package or the like pluggable unit comprising:

• an insulative body having a plurality of longitudinally spaced apart socket apertures extending through the body and arranged adjacent opposite longitudinal edges of the body in parallel aligned rows, the spacing between each of the sockets in said rows being substantially the same,
• a plurality of electrical conducting contacts having a female socket portion constructed and defined at one end and a male terminal extending therefrom, the contacts being mounted and held in each of the socket apertures with the male terminals extending outwardly from one side of the insulative body, and
• an insulative cap member having a preselected lengh with a plurality of longitudinally spaced apart entry apertures constructed and defined to extend through the cap member and arranged in aligned parallel rows adjacent opposite edges of the cap member, the cap member being secured to the insulative body with each of the entry apertures mounted in vertical alignment with the corresponding female socket portions, the number of entry apertures defined in the cap member being less than the number of socket apertures containing female socket portions in the insulative body but permitting the leads of an integrated circuit package or the like pluggable unit to be mounted into the entry apertures of the cap member in an electrical conducting relationship with the electrical contacts.