Process and device for unsoldering semiconductor modules in the flip-chip technique
AssigneeSiemens Aktiengesellschaft
InventorsOskar Wirbser, Nikolaus Ernst
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Abstract
A method and device for unsoldering semiconductor modules which are soldered onto terminal surfaces of a carrier by terminals pads composed of soft solder is disclosed herein. A suction cup is placed onto a semiconductor module to be unsoldered and the terminal pads are melted. The suction cup is raised together with the semiconductor module, and, with a burst of compressed air, the semiconductor module is removed. The suction cup is then lowered onto the terminal surfaces and soft solder residues are melted and sucked away.
Claims4
A method in the flip-chip technique for unsoldering semiconductor modules which are soldered onto terminal surfaces of a carrier by terminal pads composed of soft solder, comprising the steps of:
- a. placing a suction cup with a base forming a filter onto the semiconductor module to be unsoldered such that the module is drawn against the filter when suction is applied;
- b. melting the terminal pads with heat supplied through the suction cup and the semiconductor module;
- c. raising the suction cup together with the semiconductor module;
- d. removing the semiconductor module;
- e. placing the suction cup onto the terminal surfaces;
- and
- f. melting and sucking away remaining soft solder residues through the filter.
A device in the flip-chip technique for unsoldering semiconductor wafers which are soldered onto terminal surfaces of a carrier by terminal pads composed of soft solder, comprising
- a. a suction cup having a downwardly facing open end formed to closely surround one of the semiconductor wafers;
- b. a sheet-like filtering base having a plurality of aperture means for passing solder therethrough mounted within said suction cup at said open end;
- c. a vertically aligned tube connected to said suction cup;
- d. heating means connected to said suction cup;
- e. carrier means connected to said tube for vertical movement of said tube and suction cup;
- f. suction means connected to said tube;
- and
- g. a solder separator connected between said tube and said suction means.
Dependencies are inferred from the claim text.