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US 4,066,037 AGranted
Apparatus for depositing dielectric films using a glow discharge
AssigneeLFE Corporation
InventorAdir Jacob
Life of this patent
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Abstract
Disclosed are apparatus for forming dense and tightly adhering dielectric films on the surface of conductors, semiconductors, and insulators. The apparatus includes a reaction chamber into which a gas is admitted, dispersed, and subjected to a radio frequency exciting field to form a highly luminous glow discharge zone within the chamber. Another gas is admitted separately and is dispersed downstream from the glow discharge zone, immediately above the substrate to be coated.
Claims4
Apparatus for depositing a film on a substrate comprising:
- a reaction chamber,
- means for closing said chamber,
- means for continuously evacuating said chamber,
- means for dispersing a first gas within said chamber,
- gas excitation means external of said chamber for activating said first gas and forming an RF glow discharge zone within a portion of said chamber,
- substrate support means positioned within said chamber beyond said glow discharge zone,
- said substrate support means comprising a metallic plate having a recess therein for accepting a substrate and having heater means associated therewith for maintaining said plate at a temperature in excess of 200.degree. C,
- and means for dispersing a second gas within said chamber beyond said glow discharge zone and adjacent said substrate support means,
- whereby said activated first gas and said second gas react in the vicinity of said substrate support means to deposit a film on a substrate positioned on said substrate support means.
6 more elements
Dependencies are inferred from the claim text.